Agere Systems has announced that it is working on a new low-power, high-bandwidth throttling 802.11g chip for handhelds, rated at 54 Mbps.
Component maker Agere Systems has announced a new small-form-factor 802.11g mobile Wi-Fi module specifically designed for handheld consumer devices. The embedded system-in-package (SiP) chip is expected to deliver up to 54 Mbps data transfer, while still running at very low power.
802.11g is a backward-compatible extension to the popular 802.11b wireless ethernet standard. It uses the same 2.4 GHz band as 802.11b, but is capable of transmitting data at up to 54 Mbps under ideal conditions as compared to 802.11b's 11 Mbps.
The new Agere chip integrates nearly all the necessary components into a single module, bringing down both cost and power consumption. The module includes a "deep sleep connected" mode, designed to idle the chip at low power while still maintaining a connection to an active access point. In stand by mode, when disconnected but searching, the module consumes only 1.5 milliamps of power. It also measures only 20x29 mm, making it easy to find room for it inside a device.
The module also throttles its connection depending on the range to an associated access point. At close range, it delivers a power output of 14 dBm at 54 Mbps, while at farther ranges it shifts to 16 dBm at 12 Mbps or as low at 6 Mbps at 100 meters. That throttling ability ensures that the signal degrades gracefully, rather than simply cutting out sporadically, and does not waste power when a connection is short and easy.
The module also supports the draft specification of 802.11e, a quality-of-service requirement for voice-over-wireless and other streaming media protocols, and 802.11i, a security standard expected to be finalized in June before the module ships. Although designed for solderless circuit board integration, the module is likely also viable for use within CompactFlash designs as it utilizes a standard 16-bit connector and should, according to Agere, not exceed size restrictions. It is intended to be compatible with multiple operating systems, including multiple versions of Windows CE / Pocket PC.
Volume production of the chip is not expected until 3rd quarter of 2004, with commercial availability coming soon after. No products using the new chip have been announced.
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